Advanced Lead - SiC/GaN Power Module Packaging Engineer
- Collaborate with power module design team, provide insight on the developed module performance using simulation tools.
- Collaborate with design and R&D teams to ensure manufacturability and scalability of new GaN and SiC power module designs.
- Develop and optimize manufacturing processes for GaN and SiC power modules, including die attach, wire bonding, encapsulation, and testing.
- Identify and implement process improvements to enhance yield, efficiency, and reliability of GaN and SiC power module production.
- Utilize statistical process control (SPC) and other quality tools to monitor and improve process performance.
- Develop and implement quality control procedures to ensure compliance with industry standards and customer requirements.
- Conduct root cause analysis and implement corrective actions to address process-related quality issues.
- Guide the team to maintain detailed process documentation, including process flow diagrams, work instructions, and standard operating procedures (SOPs).
- Prepare technical reports and presentations to communicate process development and improvement activities.
- Train production staff on new processes and equipment.
- Provide technical support to production teams to resolve process-related issues.
- Ensure all manufacturing processes comply with safety regulations and company policies.
- Participate in regular safety audits and risk assessments to identify and mitigate potential hazards.
- Master's degree or higher in Electrical Engineering, Materials Science, Chemical Engineering, or a related field.
- Minimum of 3 years of experience in semiconductor manufacturing with a focus on power module packaging.
- GE Aerospace will not sponsor individuals for employment visas, now or in the future, for this job opening
- Ability and willingness to sit onsite at our Pompano Beach, FL facility location.
- PhD degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related field.
- Experience with GaN and SiC power module manufacturing and packaging technologies.
- Familiarity with industry standards and regulations related to power electronics.
- Strong knowledge of semiconductor fabrication processes, materials, and equipment.
- Excellent problem-solving and analytical skills.
- Strong communication and interpersonal skills.
- Ability to work collaboratively in a cross-functional team environment.
- Medical, dental, and vision insurance that begins on the first day of employment
- Permissive time off policy for newly hired employees
- Generous 401(k) plan
- Tuition Reimbursement
- Life insurance and disability coverage
- And more!
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